Parameters range for Silicon on Sapphire (SOS) Epi Wafers |
Wafer diameter
| 76 mm, 100 mm, 150 mm |
Orientation | (1012) ± 1o (R-plane)
|
Substrate dopant | - |
Epi-layer thickness (μm) | 0.3 – 2.0 |
Epi-layer dopant | Phosphorous, Boron
|
Epi-layer resistivity (Ohm.cm) | 2.5-30 Ohm.cm |
n-type | according to spec. |
p-type | according to spec. |
在藍(lán)寶石片上外延生長(zhǎng)一層硅薄膜以制作半導(dǎo)體集成電路的技術(shù),簡(jiǎn)稱 SOS。這種結(jié)構(gòu)能提供理想的隔離,并減小PN結(jié)底部的寄生電容,故適合于制作高速大規(guī)模集成電路,實(shí)現(xiàn)高速和低功耗。